Electronic Products & Technology

Production / Materials

March 24, 2019 by Stephen Law

Non-collapsible solder columns serve surface-mount pcbs

TOPLINE CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (pcbs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder…
March 23, 2019 by Stephen Law

Component adhesive boosts thermal conductivity

ENGINEERED MATERIAL SYSTEMS TM-6520 low temperature cure adhesive is designed for die attach and general circuit assembly applications. Product is electrically insulating and provides high thermal conductivity of 1.7 W/°K and cures in 60 minutes at 70°C or 20 minutes…
March 21, 2019 by EP&T Magazine

SEMI FlexTech funds cutting-edge projects

Projects extend impact on the flexible electronics ecosystem
March 20, 2019 by Laura Arenschield, Ohio State News

Researchers discover new material to help power electronics

Findings could mean a revamp of the way engineers create all different kinds of electronic devices
March 18, 2019 by Stephen Law

Robotic soldering reduces risk, increases productivity

EMX ENTERPRISES Metcal Robotic soldering system reduces risk and increase productivity by combining firm’s patented Connection Validation (CV) technology and Smart Interface System. CV mitigates solder joint defects by validating the intermetallic compound (IMC) formation in a soldered joint, and…
March 13, 2019 by Stephen Law

Silver conductive, one component epoxy cures at 80°C

MASTER BOND Supreme 3HTS-80 one part, silver filled epoxy adhesive is not premixed and frozen and features an unlimited working life at room temperature. Product cures at 175°F to 185°F within 2-3 hours – unlike typical heat activated epoxies that…
March 11, 2019 by EP&T Magazine

New type of brain-computer interface uses atomically thin graphene

16-Year-old heads SXSW innovation finalist company
March 8, 2019 by Stephen Law

Lead-free solder paste is no-clean

KESTER NP505-LT no-clean, lead-free, zero-halogen solder paste is for assemblies that have temperature sensitive substrates and components. Warping is becoming more evident with the trend towards complex boards and the trend of using thinner and larger packages and boards. The…
March 5, 2019 by Stephen Law

Heat-curing epoxy resin encapsulant is high-temperature-resistant

DELO MONOPOX GE6515 one-component, purely heat-curing epoxy resin encapsulant achieves very high strength, even at high temperatures. Product exhibits strength values of 20MPa on aluminum at a temperature of 150°C and 14MPa in the upper service temperature range of 200°C.…
March 3, 2019 by Stephen Law

Next-generation aqueous assembly cleaner is stable

KYZEN AQUANOX A4727 next-generation aqueous assembly cleaner is effective, stable and predictable, all day, every day, while providing reliable production and assembly operations. Product delivers a stable pH and predictable compatibility throughout its long bath life. Environmentally responsible, product is…
March 1, 2019 by Stephen Law

Smart camera includes multi-colour light, high-rez image sensor

OMRON AUTOMATION FHV7-series smart camera with an all-new multi-colour light and high-resolution image sensor for advanced vision inspections on high-mix production lines. Unit provides multi-colour light alongside a range of best-in-class image sensors (0.4MP to 5MP, with 12MP coming in…
February 28, 2019 by Stephen Law

No clean cored wire solder improves results

AIM CX18 and RX18 no clean cored wire solders improve soldering results with all lead-free alloys and on all surface finishes. Engineered for high operator satisfaction, CX18 is a low odour/smoke formula that promotes thermal transfer and fast wetting without…