Solder paste serves AI substrate power management modules

SHENMAO PF719-P250A solder paste is specifically designed for AI substrate power management modules, providing advancement in thermal fatigue reliability and performance. Product delivers high anti-thermal fatigue reliability, adopting a newly designed lead-free alloy (Sn/3.9Ag/0.6Cu/3.0Sb) that demonstrates enhanced anti-thermal fatigue performance, while meeting the stringent demands of modern electronics manufacturing. Product features halogen-free (ROL0) with no intentionally added halogen, ensuring compliance with RoHS, RoHS 2.0, and REACH standards.

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