Dorigo speeds its production with 3D solder paste system

Dorigo has implemented the Koh Young KY8030-3 Solder Paste Inspection (SPI) and 3D AOI system into its high speed printed circuit board (pcb) assembly lines.

Looking at ways of speeding up its production processes, electronics manufacturing services (EMS) provider Dorigo Systems Ltd., Burnaby BC, has integrated the Koh Young KY8030-3 Solder Paste Inspection (SPI) and 3D AOI system into its high speed printed circuit board (pcb) assembly lines providing true 3D optical inspection.

Dorigo is one of only a few select EMS providers in Canada that uses a true 3D measuring system providing foreign material inspection for the entire PCBA – vastly improving the ability to detect board defects during the manufacturing process.

“At Dorigo, we continue to adapt our electronics manufacturing processes to achieve close to zero board defects,” says Paul Vasvary, business development manager, Dorigo Systems. “By implementing the Koh Young Technology that analyzes true 3D measurement, Dorigo is building pcb assemblies right the first time.”

AOI system detects all kinds of board defects

By accessing all board data, Dorigo Systems uses an inspection solution that collects and analyzes large amounts of data producing traceable results and increasing board quality. The Koh Young KY8030-3 SPI and 3D AOI system detects all kinds of board defects using patented shadow-free 3D moiré technology including: missing, offset, rotation, polarity, upside down, OCV/OCR, solder filet, billboarding, lifted lead, lifted body, and tombstone bridging.

“The Zenith series provides superior results by measuring every aspect of the component and solder joint according to IPC-A-610 standards,” adds Chas Yu, Dorigo’s quality manager. “By quickly measuring components and solder joints, and then offering critical height information to the inspection algorithms, we can now immediately identify errors like pad overhang and insufficient solder.”