Category
Semiconductors
Product
Piezo driver chip advances realistic haptic feedback in automotive HMIs
BOREAS TECHNOLOGIES BOS1211, the first low-power high-voltage piezoelectric driver integrated circuit (IC) enables high-definition (HD) haptic feedback in automotive human machine interfaces (HMIs), such as automotive infotainment screens and safety alerts in touch-sensitive steering wheels. Designed to support TDK Electronics’…
Product
High-efficiency power management IC adopted in Google Coral AI products
RENESAS ELECTRONICS ISL91301B Power Management IC (PMIC) is designed into the latest Google Coral products, including the Mini PCIe Accelerator, M.2 Accelerator A+E Key, M.2 Accelerator B+M Key and System-on-Module (SoM). Google Coral integrates seamlessly into processes at any scale, helping…
News
New heat model may help electronic devices last longer
Knowledge can help chip manufacturers find ways to better diffuse the heat that leads to device damage
Product
Low power FPGA platform serve wide range of development
LATTICE SEMICONDUCTOR Nexus low power FPGA platform is architected to deliver power-efficient performance that will benefit developers of a wide range of applications, including AI for IoT, video, hardware security, embedded vision, 5G infrastructure and industrial/automotive automation. Platform augments the…
Feature
A look back at 40 years of electronics design
The final instalment of EP&T's 40th anniversary column takes a look at the importance of large scale industry trade shows in the 1980s
Product
RF power multi-chip modules support MIMO active antenna systems
RICHARDSON RFPD NXP Semiconductors RF power multi-chip module (MCM) portfolio for 5G mMIMO are part of NXP’s 5G Airfast solutions product family and include LDMOS power amplifier modules, GaAs pre-driver modules and receiver modules for cellular frequency bands from 2.3GHz…
Product
MCU provides full Bluetooth 5.0 low energy support
RENESAS 32-bit RX23W MCU provides full Bluetooth 5.0 low energy support allowing users to optimize system control and wireless communication applications while providing a more secure way to answer Bluetooth security risks such as eavesdropping, tampering and viruses. Device means…
Product
IC enables ultra high-speed precision motion control of time synchronization accuracy
RENESAS R-IN32M4-CL3 IC for industrial Ethernet (IE) communication delivers support for CC-Link IE Time Sensitive Networking (TSN), a communication standard for next-generation Ethernet TSN technology. Device satisfies the strict specifications of less than one-millionth of a second time synchronization accuracy…
Product
High-speed IR emitters boost brightness over wider temp range
VISHAY SEMICONDUCTORS VSMY5850X01 (850nm), VSMY5890X01 (890nm) and VSMY5940X01 (940nm) high-speed infrared (IR) emitters are built on firm’s SurfLight surface emitter chip technology, and deliver 30% greater radiant intensity than prior-generation devices, over a wide temperature range from -40°C to +110°C. Devices…
News
NVIDIA unveils AI supercomputer for robotic, embedded devices
Firm calls it world’s smallest, most powerful AI supercomputer for computing devices at the edge
Product
105C ambient temp-qualified Bluetooth 5.1 SoC enables a wider range of applications
NORDIC SEMICONDUCTOR nRF52833 advanced multiprotocol System-on-Chip (SoC) is an ultra-low power Bluetooth Low Energy (Bluetooth LE), Thread, Zigbee, and 2.4-GHz proprietary wireless connectivity solution that includes a Bluetooth 5.1 Direction Finding-capable radio and is qualified for operation across a -40…
Product
Embedded vision processor simplifies automotive SoC development
SYNOPSYS DesignWare ARC EV7x Embedded Vision Processor IP family and Functional Safety Processor IP portfolio simplifies automotive SoC development. Processors come with deep neural network (DNN) accelerator and deliver industry-leading 35 TOPS performance for AI SoCs. EV7x’s DNN accelerator scales…