Electronic Products & Technology


June 21, 2018 by Stephen Law

FPGA solution opens doors for rapid deployment of machine learning inferencing

LATTICE SEMICONDUCTOR sensAI complete technology stack combines modular hardware kits, neural network IP cores, software tools, reference designs and custom design services – to accelerate integration of machine learning inferencing into broad market IoT applications. With solutions optimized for ultra-low…
May 27, 2018 by Stephen Law

Fully-matched, 5-6 GHz RF power transistor delivers 25W of power

INTEGRA TECHNOLOGIES IGT5259CW25 fully-matched, gallium nitride on silicon carbide (GaN/SiC), RF power transistor that is ideal for C-band, continuous wave (CW) applications. Device is fully matched to 50-ohms, operates at the instantaneous frequency range 5.2 – 5.9GHz, and delivers a…
May 20, 2018 by Stephen Law

Multi-phase buck converters serve automotive infotainment systems

DIALOG SEMICONDUCTOR DA9223-A and DA9224-A Auto Grade 0.8mm Pitch Multi-Phase Buck Converter DA9223-A and DA9224-A are PMICs optimized for the supply of CPUs, GPUs, and DDR memory rails in automotive in-vehicle infotainment systems, Advanced Driver Assistance Systems (ADAS), navigation and…
May 16, 2018 by Stephen Law

Secure authenticator IC delivers a cryptographic solution

NXP SEMI A1006- Secure Authenticator IC is manufactured in a high density sub-micron technology. The tamper resistant device delivers a cryptographic solution intended to be used by device manufacturers to prove the authenticity of their genuine products. Solution is a…
May 14, 2018 by Stephen Law

MMIC mixers lower conversion loss

CUSTOM MMIC CMD253C3, CMD254C3, and CMD255C3 monolithic microwave integrated circuits (MMICs) are high performance IP3 fundamental mixers that provide overlapping RF/LO frequencies spanning 6GHz to 26GHz, with each model demonstrating low conversion loss high IP3, high isolation and wide IF bandwidth. Devices…
May 11, 2018 by EP&T Magazine

Si2 open model provides industry-wide interface for SPICE capabilities

The Silicon Integration Initiative Compact Model Coalition has released the Open Model Interface, an Si2 standard, C-language application programming interface that supports SPICE compact model extensions.  OMI allows circuit designers to simulate and analyze such important physical effects as self-heating and…
May 4, 2018 by Kelvin Chan, The Associated Press, Hong Kong

Chip wars: Tech rivalry underlies US China trade conflict

Chinese and American officials will be trying to defuse tensions pushing the world’s two largest economies toward trade war in meetings beginning Thursday where analysts say chances for a breakthrough seem slim given the two sides’ desperate rivalry in strategic…
April 28, 2018 by Stephen Law

FPGA programmable platform comprises logic, routing, embedded memory

EFINIX Trion programmable platform in FPGA architectural innovation was built using firm’s Quantum programmable technology, comprising logic, routing, embedded memory and DSP blocks. The first eight FPGAs in the Trion platform are built on SMIC’s (Semiconductor Manufacturing International Corp.) 40nm process.…
April 27, 2018 by Stephen Law

IC delivers chip-to-cloud security right out of the box

NXP A71CH IC is a ready-to-use secure element for IoT devices providing a root of trust at the IC level and delivers, chip-to-cloud security right out of the box, so you can safely connect to IoT clouds and services, including AWS,…
April 26, 2018 by Stephen Law

36V, 1A dc-dc step-down power module shrinks board space

TEXAS INSTRUMENTS 0.5-A LMZM23600 and 1-A LMZM23601 dc-dc step-down converters range from 4V to 36V, measure 3mm by 3.8mm and require two external components for operation. Power modules achieve up to 92% efficiency, which minimizes energy loss and feature tiny MicroSiP packaging…
April 23, 2018 by EP&T Magazine

Global semi industry has highest growth rate in 14 years

Samsung edged out Intel, to become the new semiconductor industry leader, IHS Markit says
April 20, 2018 by Stephen Law

Integrated DSP+CPU architecture boosts efficiency processing in low power IoT devices

CEVA-X1 IoT Processor implements a single-core DSP+CPU architecture, specifically designed to address the severe size, power and cost constraints imposed by the latest eMTC Cat-M1 and eNB-IoT Cat-NB2 standards, as well as future FeMTC and 5G cellular IoT deployments. The…