Electronic Products & Technology


October 9, 2019 by EP&T Magazine

Samsung develops industry’s first 12-Layer 3D-TSV chip packaging technology

The new technology allows for the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips
September 19, 2019 by Stephen Law

FPGAs alleviate memory bottlenecks

XILINX Virtex UltraScale+ HBM FPGAs alleviate memory bottlenecks with integrated HBM. Devices are suitable for latency-sensitive workloads that process large datasets such as adaptable AI inference; database acceleration and data analytics; video transcoding; security processing. With devices with up to…
September 17, 2019 by Stephen Law

Unidirectional power switch isolates terminals when fault occurs

NXP NX30P0121UK advanced 3A unidirectional power switch includes Undervoltage Lockout (UVLO), Overvoltage Lockout (OVLO) in VOUT, OVLO adjustable pin and over-temperature protection circuits. Device automatically isolates the power switch terminals when a fault condition occurs. Both VIN and VOUT pins…
September 10, 2019 by Adam Khan, founder & CEO, AKHAN Semiconductor

The case for diamond semiconductors

Newly developed technology aims to impact and transform all industries
September 6, 2019 by The Associated Press, Berlin Germany

Huawei debuts latest advanced chipset for smartphone

The latest semiconductor technology lowers energy use and delivers superfast 5G download speed
September 5, 2019 by EP&T Magazine

Chip debacle continues in the first half

Semiconductor market posts worst results since 2009
August 19, 2019 by EP&T Magazine

Samsung narrows Intel’s global chip market lead

Intel in the second quarter maintained its position as the world’s largest semiconductor supplier, although second-placed Samsung managed to close the gap due to renewed vigor in some key memory products, according to IHS Markit.  Intel extended its leadership reign…
August 18, 2019 by Stephen Law

GaN-based ac-dc converter ICs boost power, efficiency

POWER INTEGRATIONS InnoSwitch 3 families of offline CV/CC flyback switcher ICs provide up to 95% efficiency across the full load range and up to 100W in enclosed adapter implementations without requiring a heatsink. This performance is achieved using an internally…
August 16, 2019 by Stephen Law

Crossover processor comes with Arm Cortex-M7 core

NXP SEMICONDUCTORS i.MX RT1010 crossover processor with Arm Cortex-M7 core provides a high level of integration and security up to 500MHz. Affordable performance with ease-of-use, chip is firm’s latest break-through device that enables improved performance. Device carries forth the ease-of-use…
August 9, 2019 by EP&T Magazine

Storage processor boosts data centre efficiency

Newly developed architecture increases data centre storage by more than 60x
August 6, 2019 by Stephen Law

LoRa Transceivers suit IoT applications

FUTURE ELECTRONICS Semtech SX1261 and SX261 LoRa sub-GHz radio transceivers are suitable for for long range wireless and IoT applications. Both devices deliver long battery life with 4.2mA of active receive current consumption. SX1261 can transmit up to +15dBm and…
August 1, 2019 by Stephen Law

Ultra-small RX651 32-Bit microcontrollers reduce pcb footprint

RENESAS ELECTRONICS RX651 32-bit microcontrollers (MCUs) supplied in ultra-small 64-pin BGA and LQFP packages reduce footprint size by 59% compared to the 100-pin LGA and a 64-pin (10mm x 10mm) LQFP that provides a 49% reduction versus the 100-pin LQFP.…