Electronic Products & Technology


February 5, 2020 by EP&T Magazine

AI functioning semis set to soar

Sales of semiconductors performing artificial intelligence functions set to triple by 2025 reshaping chip markets
February 4, 2020 by EP&T Magazine

New standard allows stacked dies in 3D integrated circuits to connect with test equipment

An imec-initiated industry collaboration leads to publication of IEEE Std 1838TM for test access architectures for 3D integrated circuits (3D-ICs)
February 4, 2020 by Stephen Law

Power transistors achieve industry-leading performance

SIEMENS is integrating part of its Simatic Micro-Drive product line with GaN SYSTEMS power semiconductors. With the integration of GaN Systems power transistors, this Siemens product line features industry-leading standards such as improved power density, efficiency and robustness. The Simatic…
January 29, 2020 by Stephen Law

Bluetooth microcontroller intelligence includes value-added NFC peripheral

NXP SEMICONDUCTOR QN9090 and QN9030 Bluetooth 5 System on Chip (SoC) with hardware compatible options for 802.15.4, Multiprotocol RF and optional NFC technology. The latest additions to its QN series of Bluetooth Low Energy (BLE) devices enable next generation intelligent…
January 24, 2020 by EP&T Magazine

GAN Systems captures CleanTech award

GaN Systems, Ottawa-based provider of GaN (gallium nitride) power semiconductors, has been named a 2020 Global Cleantech 100 company by Cleantech Group.  The 2020 Global Cleantech 100 is the 11th edition of the annual guide to the leading companies and themes in sustainable…
January 22, 2020 by Stephen Law

RFSoCs integrate comprehensive RF analog-to-digital signal chain

XILINX Zynq UltraScale+ RFSoCs integrate multi-gigasample RF data converters and soft-decision forward error correction (SD-FEC) into an SoC architecture. Complete with an Arm® Cortex-A53 processing subsystem and UltraScale+ programmable logic, product family has no competitors with only single-chip, adaptable radio…
January 14, 2020 by Stephen Law

Piezo driver chip advances realistic haptic feedback in automotive HMIs

BOREAS TECHNOLOGIES BOS1211, the first low-power high-voltage piezoelectric driver integrated circuit (IC) enables high-definition (HD) haptic feedback in automotive human machine interfaces (HMIs), such as automotive infotainment screens and safety alerts in touch-sensitive steering wheels. Designed to support TDK Electronics’…
January 7, 2020 by Stephen Law

High-efficiency power management IC adopted in Google Coral AI products

RENESAS ELECTRONICS ISL91301B Power Management IC (PMIC) is designed into the latest Google Coral products, including the Mini PCIe Accelerator, M.2 Accelerator A+E Key, M.2 Accelerator B+M Key and System-on-Module (SoM). Google Coral integrates seamlessly into processes at any scale, helping…
December 29, 2019 by University of Illinois at Urbana-Champaign, News Bureau

New heat model may help electronic devices last longer

Knowledge can help chip manufacturers find ways to better diffuse the heat that leads to device damage
December 12, 2019 by Stephen Law

Low power FPGA platform serve wide range of development

LATTICE SEMICONDUCTOR Nexus low power FPGA platform is architected to deliver power-efficient performance that will benefit developers of a wide range of applications, including AI for IoT, video, hardware security, embedded vision, 5G infrastructure and industrial/automotive automation. Platform augments the…
December 10, 2019 by EP&T Magazine

A look back at 40 years of electronics design

The final instalment of EP&T's 40th anniversary column takes a look at the importance of large scale industry trade shows in the 1980s
December 7, 2019 by Stephen Law

RF power multi-chip modules support MIMO active antenna systems

RICHARDSON RFPD NXP Semiconductors RF power multi-chip module (MCM) portfolio for 5G mMIMO are part of NXP’s 5G Airfast solutions product family and include LDMOS power amplifier modules, GaAs pre-driver modules and receiver modules for cellular frequency bands from 2.3GHz…