Category
Semiconductors
News
AI functioning semis set to soar
Sales of semiconductors performing artificial intelligence functions set to triple by 2025 reshaping chip markets
News
New standard allows stacked dies in 3D integrated circuits to connect with test equipment
An imec-initiated industry collaboration leads to publication of IEEE Std 1838TM for test access architectures for 3D integrated circuits (3D-ICs)
Product
Power transistors achieve industry-leading performance
SIEMENS is integrating part of its Simatic Micro-Drive product line with GaN SYSTEMS power semiconductors. With the integration of GaN Systems power transistors, this Siemens product line features industry-leading standards such as improved power density, efficiency and robustness. The Simatic…
Product
Bluetooth microcontroller intelligence includes value-added NFC peripheral
NXP SEMICONDUCTOR QN9090 and QN9030 Bluetooth 5 System on Chip (SoC) with hardware compatible options for 802.15.4, Multiprotocol RF and optional NFC technology. The latest additions to its QN series of Bluetooth Low Energy (BLE) devices enable next generation intelligent…
News
GAN Systems captures CleanTech award
GaN Systems, Ottawa-based provider of GaN (gallium nitride) power semiconductors, has been named a 2020 Global Cleantech 100 company by Cleantech Group. The 2020 Global Cleantech 100 is the 11th edition of the annual guide to the leading companies and themes in sustainable…
Product
RFSoCs integrate comprehensive RF analog-to-digital signal chain
XILINX Zynq UltraScale+ RFSoCs integrate multi-gigasample RF data converters and soft-decision forward error correction (SD-FEC) into an SoC architecture. Complete with an Arm® Cortex-A53 processing subsystem and UltraScale+ programmable logic, product family has no competitors with only single-chip, adaptable radio…
Product
Piezo driver chip advances realistic haptic feedback in automotive HMIs
BOREAS TECHNOLOGIES BOS1211, the first low-power high-voltage piezoelectric driver integrated circuit (IC) enables high-definition (HD) haptic feedback in automotive human machine interfaces (HMIs), such as automotive infotainment screens and safety alerts in touch-sensitive steering wheels. Designed to support TDK Electronics’…
Product
High-efficiency power management IC adopted in Google Coral AI products
RENESAS ELECTRONICS ISL91301B Power Management IC (PMIC) is designed into the latest Google Coral products, including the Mini PCIe Accelerator, M.2 Accelerator A+E Key, M.2 Accelerator B+M Key and System-on-Module (SoM). Google Coral integrates seamlessly into processes at any scale, helping…
News
New heat model may help electronic devices last longer
Knowledge can help chip manufacturers find ways to better diffuse the heat that leads to device damage
Product
Low power FPGA platform serve wide range of development
LATTICE SEMICONDUCTOR Nexus low power FPGA platform is architected to deliver power-efficient performance that will benefit developers of a wide range of applications, including AI for IoT, video, hardware security, embedded vision, 5G infrastructure and industrial/automotive automation. Platform augments the…
Feature
A look back at 40 years of electronics design
The final instalment of EP&T's 40th anniversary column takes a look at the importance of large scale industry trade shows in the 1980s
Product
RF power multi-chip modules support MIMO active antenna systems
RICHARDSON RFPD NXP Semiconductors RF power multi-chip module (MCM) portfolio for 5G mMIMO are part of NXP’s 5G Airfast solutions product family and include LDMOS power amplifier modules, GaAs pre-driver modules and receiver modules for cellular frequency bands from 2.3GHz…