Electronic Products & Technology



Product
May 5, 2019 by Stephen Law

Solder paste serves nitrogen and air reflow applications

KESTER WP616 zero-halogen, lead-free, water-soluble solder paste formula is suitable for both nitrogen and air reflow applications. Product provides a combination of consistent print performance at wide humidity levels, boosts solderability and ease of cleaning, while maintaining a zero-halogen flux…
Product
April 2, 2019 by Stephen Law

Lead-free solder paste is no clean

KESTER NP560 no-clean, lead-free, halogen-free solder paste consistently delivers paste transfer efficiencies of 0.50 to 0.55 AR and is fully capable of printing and reflowing 01005 components, even in air, with minimal graping behavior. Product provides stable, consistent product performance,…
Product
March 24, 2019 by Stephen Law

Non-collapsible solder columns serve surface-mount pcbs

TOPLINE CCGA Column Grid Array IC packages are made with non-collapsible solder columns for surface mount soldering on printed circuit boards (pcbs) and provide more compliancy than solder balls (Ball Grid Arrays or BGAs) to absorb stress and increase solder…
Product
March 8, 2019 by Stephen Law

Lead-free solder paste is no-clean

KESTER NP505-LT no-clean, lead-free, zero-halogen solder paste is for assemblies that have temperature sensitive substrates and components. Warping is becoming more evident with the trend towards complex boards and the trend of using thinner and larger packages and boards. The…
Product
February 12, 2019 by Stephen Law

Temperature stable solder comes in low-voiding formulation

HENKEL LOCTITE GC 18 solder material is a low-voiding formulation designed for use with multiple component sizes and types, including large, thermally-challenged devices such as MOSFETs, LPBGAs, QFNs and large array components. Product is available in Type 3 and Type…
Product
February 2, 2019 by Stephen Law

Solder product addresses reliability, production quality issues

AIM REL22 solder has been developed to address reliability and production quality issues common to similar multi-element alloys. Both internal and customer testing has proven that it improves product survival in extreme thermal exposure operating environments, such as under-hood automotive,…
Product
January 24, 2019 by Stephen Law

Unit automates hot bar reflow soldering, flux dispensing

NORDSON DIMA C-TurnFlux automated stand-alone hot bar system combines flux dispensing with hot bar reflow soldering. Product combines both high output and quality, using high-speed product handling and guaranteed position repeatability for mission-critical assembly applications. System is used to solder…
Product
January 20, 2019 by Stephen Law

Solder paste printer automates changeover system

YAMAHA MOTOR YSP10 High-speed, high-precision universal, high-end solder paste printer boasts a completely automatic changeover system that features a completely programmable squeegee angle adjustment and stencil suction mechanism as standard equipment. Unit enables full automation of production changeover, which typically…
Product
January 15, 2019 by Stephen Law

Solder wire for automatic equipment is lead, halogen-free

SHENMAO AMERICA PF606-F13 lead-free and halogen-free solder wire improves the working environment for a variety of automatic soldering applications, including: TPC soldering, buzzer, bending element, LCD panel, embedded element, solder joints, wire soldering, button, screen connector and FPC soldering. Product…
Product
January 7, 2019 by Stephen Law

Wave solder process speeds de-drossing times

EVS INTERNATIONAL EVS 8KLFHS solder recovery system features an integrated hopper that makes rapid transfer of dross simpler and safer, and speeds de-drossing times by up to 75%. Unit provides a capacity of 6kg/12lbs, while delivering a cleaner wave with…
Product
November 27, 2018 by Stephen Law

High thermal solder alloys deliver impact reliability

SHENMAO AMERICAPF906-S and PF912-S high thermal/drop reliability series solder alloys can be used in a wide range of solder applications. Products have a similar operating temperature window to Sn-Ag-Cu alloys, so that they can easily be adopted into existing packaging…
Product
November 18, 2018 by Stephen Law

Solder paste jet system improves dispense accuracy

NORDSON EFD Liquidyn P-Jet SolderPlus jetting valve is designed for non-contact dispensing of solder pastes. Firm’s solder paste formulations save time and streamline implementation by delivering a complete solder jetting solution. Dispense micro-deposits as small as 700µm at speeds up…