Electronic Products & Technology



News
August 24, 2019 by EP&T Magazine

GSC welcomes Canada’s use of a risk-based assessment of siloxanes

Regulators conclude L2, L4, L5 and D3 pose low risk to environment and human health
Feature
July 23, 2019 by Sam Million-Weaver, University of Wisconsin-Madison

Simple ‘smart’ glass reveals the future of artificial vision

Smart glass that can recognize images without requiring any sensors or circuits or power sources
News
April 29, 2019 by EP&T Magazine

Next gen material serves flexible touchscreen displays

ActiveGrid Gen 7 Ink boosts optical quality with enhanced flexibility
News
April 5, 2019 by Ryan Owens, University of Missouri

Teaching computers to intelligently design ‘billions’ of possible materials

A team of MU researchers are applying one of the first uses of artificial intelligence principles to the field of materials science
Product
March 23, 2019 by Stephen Law

Component adhesive boosts thermal conductivity

ENGINEERED MATERIAL SYSTEMS TM-6520 low temperature cure adhesive is designed for die attach and general circuit assembly applications. Product is electrically insulating and provides high thermal conductivity of 1.7 W/°K and cures in 60 minutes at 70°C or 20 minutes…
News
March 20, 2019 by Laura Arenschield, Ohio State News

Researchers discover new material to help power electronics

Findings could mean a revamp of the way engineers create all different kinds of electronic devices
Product
February 6, 2019 by Stephen Law

Ultra-low modulus thermal interface materials contain advanced resin

HENKEL BERGQUIST GAP PAD thermal interface materials (TIMs) comes in two ultra-low modulus, including TGP 6000ULM and TGP 7000ULM, both formulated with an advanced resin platform to deliver ultra-low modulus capabilities and high thermal conductivity of 6.0 W/m-K and 7.0…
Product
January 18, 2019 by Stephen Law

Next gen laminates serve automotive radar sensor apps

ROGERS CORP RO3003G2 high-frequency PTFE circuit laminate materials provide radar sensor designers with improved insertion loss and reduced dielectric constant (Dk) variation. The combination of optimized resin and filler content along with the introduction of Very Low Profile ED copper…
News
November 22, 2018 by Science and Technology of Advanced Materials, Tsukuba, Japan

Materials harvest heat, converts to power electronic devices

Inorganic thermoelectric materials efficiently convert heat into electricity
News
October 10, 2018 by Jennifer Chu, MIT News Office 

Study opens route to flexible electronics made from exotic materials

Cost-effective method produces semiconducting films from materials that outperform silicon
Product
August 22, 2018 by Stephen Law

High thermal, semi-sintering die attach paste overcomes process challenges

HENKEL Loctite Ablestik ABP 8068T series of die attach materials includes high thermal, semi-sintering die attach pastes that provide simplified processing and best-in-class thermal and electrical performance with robust reliability for high power density devices. Materials combine high thermal conductivity,…
News
May 30, 2018 by Lisa Kulick, Carnegie Mellon University College of Engineering

Autonomously self-healing material a breakthrough for soft-matter electronics

Researchers at Carnegie Mellon University have created a self-healing material that spontaneously repairs itself