LEAD-FREE SOLDER PASTE RESISTS HUMIDITY

Multicore LF318 is a halide-free, no-clean, pin-testable formulation promises broad process windows for both printing and reflow. The product has been developed to appeal particularly to multinational manufacturers wishing to qualify a single solder paste that offers reliable, repeatable performance within the assembly environment, under any climatic conditions. LF318 reportedly achieves a consistently high degree of coalescence upon reflow even after 72 hours at 27 Celsius and 80 percent relative humidity, and in testing to IPC ANSI/J-STD-005 and JIS-Z-3284 standards displays resistance to slump.
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