Solder paste caters to automotive needs for high reliability

HERAEUS ELECTRONICS Microbond SMT660 Innolot 2.0 solder paste caters to the automotive industry’s approach to highly reliable and cost-effective solder alloys. Microbond SMT660 flux, in combination with different alloys, delivers enhanced performance and reliability. Products provide improved reflow performance, standing out for its performance in the reflow process without the need for additional nitrogen (N2). This feature minimizes defect rates and contributes to a reduced Total Cost of Ownership (TCO) for manufacturers.

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