No clean solder paste serves emerging, advanced applications
EP&T MagazineElectronics Production / Materials AIM materials no-clean paste production solder
AIM SOLDER NC259FPA Ultrafine No Clean Solder Paste with ultra fine alloy powders, such as T6 or finer, are essential for a range of emerging and advanced applications where precision, reliability and miniaturization are paramount. Product is formulated specifically for Type 6 and finer solder powders, and provides efficient transfer rates and precise print definition. Product’s activator system promotes improved wetting on various surface finishes, resulting in strong shear values of up to 150 gf. It also leaves residue with high Surface Insulation Resistance (SIR) values and a clear appearance. NC259FPA is designed to deliver the tack force necessary for effective mass transfer assembly.