Underfill encapsulant enables complex AI, HPC large body advanced packaging designs

HENKEL Loctite Eccobond UF 9000AE semiconductor capillary underfill encapsulant provides large, high I/O die protection, delivers high reliability and void-free, fast flow encapsulation efficiency. Product addresses the unique requirements of the market’s most demanding advanced packages, like those used in artificial intelligence (AI) and high-performance computing (HPC) applications. Product protects large die within flip-chip BGA (FCBGA), high-density fan-out (HD-FO), and 2.5-D advanced packaging devices. Product completely envelops fine-pitch, low gap height die interconnects for rigid protection against stress to deliver good electrical, moisture, and thermal reliability performance for high production yields. The material’s low shrinkage and toughness provide die and underfill crack resistance, while its low coefficient of thermal expansion (CTE) protects against warpage. Product has low resin bleed out (RBO) and forms narrow fillets, allowing the dense die integration inherent in advanced packaging techniques.

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