Electronic Products & Technology



Product
February 20, 2020 by Stephen Law

High thermal gap pads boost conductivity in power designs

HENKEL BERGQUIST GAP PAD TGP 10000ULM thermal interface materials (TIMs) address the high power density challenges associated with new 5G telecom infrastructure and consumer mobility designs. Product’s formulation provides exceptionally high thermal conductivity of 10.0W/m-K within an ultra-low modulus, low…
News
February 14, 2020 by EP&T Magazine

Using waste heat to power electronics

Researchers from the University of Tsukuba develop an improved energy-harvesting device that can convert heat to electricity
Product
December 31, 2019 by Stephen Law

Pin/slot fin coolers serve modular LED products

JARO THERMAL PinFIN (JX) series of LED (heatsink) coolers meet the specific power requirements of LED down lights, spotlights and high-bay lights (from 45-225mm in diameter).Device provide mechanical compatibility with direct mounting of the SMD products to the LED cooler…
News
December 29, 2019 by University of Illinois at Urbana-Champaign, News Bureau

New heat model may help electronic devices last longer

Knowledge can help chip manufacturers find ways to better diffuse the heat that leads to device damage
Product
December 18, 2019 by Stephen Law

High-resolution OEM thermal cameras integrate with most designs

SEEK THERMAL Micro and Mosaic Core series of OEM thermal cameras can be integrated into products and services across several industries, delivering optimal performance in applications such as IoT, test & measurement, security surveillance and beyond. Device’s low price per-pixel…
Product
November 25, 2019 by Stephen Law

Thermal gap fillers serve delicate components

FUJIPOLY AMERICA Sarcon Low Compression Force gap filler pads are suitable for applications that have delicate components or widely varying gap distances. TIMs help avoid overstressing the printed circuit board (pcb) and fragile solder joints as the interface material is compressed…
Feature
November 19, 2019 by Manuel Martinez, product manager L-com

A brief overview of NEMA rated enclosures

A great deal of consideration must be put into a facility’s various equipment installs and their respective interconnects
Product
November 5, 2019 by Stephen Law

Thermal circuit breaker reduces stoppages, downtime

WEIDMULLER Type 1180 thermal circuit breaker reduces stoppages and downtime. In combination with a modular style terminal block the circuit breaker provides individual protection for every circuit. 1180 Plus offers protection for 12&24Vdc circuits in a terminal block modular base.…
Product
October 22, 2019 by Stephen Law

Thermal management software suite determines climate product

RITTAL Therm 6.6 thermal management software suite package simplifies the decision of which climate product required for any specific application. Using a few parameters such as maximum ambient temperature, desired internal temperature, enclosure size, and heat loss of installed components, software…
Product
October 16, 2019 by Stephen Law

Low-height bracket fan cools with skived copper heatsink

JARO THERMAL Skived-copper bracket fan contains a fully embedded, 50x50x12.6mm fan – inside of a skived-copper-fin heatsink. The ‘skive’ cooler reduces height requirements for low-profile applications, while providing improved surface-area. The dense arrangement of thin copper fins provide enhanced thermal…
Product
October 14, 2019 by Stephen Law

High-temperature industrial thermal camera delivers non-contact measurement

FLIR SYSTEMS TG297 industrial thermal camera provides non-contact high-temperature measurement and thermal imaging for professionals in one tool. The versatile product for industrial troubleshooting provides a filter that enables maintenance, repair and operations inspectors to visually identify and find the…
Product
October 12, 2019 by Stephen Law

Thermal gap filler serves high power designs

FUJIPOLY AMERICA Sarcon GR80A-00-100GY is a 1.0mm thick thermal interface material that delivers a thermal conductivity of 13.0W/m•K with a thermal resistance of 1. 0° C•in2/W, which are often required in higher-power electronics applications. When placed between heat generating components…