Solder masks, systems optimize production processes

LEUTZ GFRP solder masks integrated into firm’s soldering systems enable a variety of soldering processes and ensure suitable and reproducible results. The soldering frame precisely positions and fixes both flexible and rigid pcb, while the solder mask protects selected areas of a pcb from direct contact with the solder. SMD components, surrounding contact surfaces, gold contacts and technically complex pcb layouts with SMD components attached to the underside can be shielded.

Titanium solder masks provide enhanced properties and performance advantages, delivering effective protection during the soldering process, especially for SMD and THT components. Titanium allows the production of thin bridges of up to 0.3 mm, which also makes the material suitable to produce complex pcbs. In addition, specially manufactured titanium solder masks ensure efficient heat transfer, which significantly increases the soldering quality and therefore the overall reliability of electronic products.

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