No-clean solder paste contains zero halogen

AIM SOLDER NC259FPA Ultrafine No-Clean Solder Paste is a zero halogen paste engineered for precise print definition with type 6 and smaller alloy powders through stencil apertures less than 150µm in diameter. Suitable for miniLED, microLED, die attach, micro BGA, and HDI boards, the product provides improved wetting, high transfer efficiency, high reliability, and high tack force for mass transfer.

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