Low-temp solder paste is joint enhanced

SHENMAO AMERICA PF735-EP307 Joint Enhanced Solder Paste (JEP) is a new low melting point epoxy-based solder material that has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly. Product has the advantages of conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. The epoxy is cured after reflow and provides excellent bonding strength and joint protection. Reliability performance is enhanced as well. Product adopts the newly designed epoxy-based flux that performs better in regards to printability, longer printing lifetime and better reliability than typical epoxy-based solder pastes. With the low melting point alloy PF735, the paste can reduce the reflow temperature to below 190°C compared to lead-free soldering, typically 240°-250°C, and hence decrease pcb and substrate deformation while saving energy, reducing the thermal stability requirement of pcbs and components, and raising yield rates.

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