Electronic Products & Technology

Ultra-low modulus thermal interface materials contain advanced resin

February 6, 2019  Stephen Law

HENKEL BERGQUIST GAP PAD thermal interface materials (TIMs) comes in two ultra-low modulus, including TGP 6000ULM and TGP 7000ULM, both formulated with an advanced resin platform to deliver ultra-low modulus capabilities and high thermal conductivity of 6.0 W/m-K and 7.0 W/m-K, respectively. Products provide improved performance combination in custom-sized pads with easy handling to enhance process efficiency. Products provide very soft pads with high conformability to rough or irregular surfaces, effectively filling intricate gaps and allowing for thorough wet out at the interface for maximum thermal transfer. Product’s advanced silicone-based resin formulation and filler package provide low assembly stress alongside high thermal control.

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