Electronic Products & Technology



Product
February 20, 2020 by Stephen Law

High thermal gap pads boost conductivity in power designs

HENKEL BERGQUIST GAP PAD TGP 10000ULM thermal interface materials (TIMs) address the high power density challenges associated with new 5G telecom infrastructure and consumer mobility designs. Product’s formulation provides exceptionally high thermal conductivity of 10.0W/m-K within an ultra-low modulus, low…
Product
June 14, 2019 by Stephen Law

Touch line brings high quality to visual applications

WAGO Touch Panel 600 line of operator interface devices brings high-tech screens and improved quality visualizations to allow users to accompany machines with advanced features. Engine has a Cortex A9 multicore processor providing fast operating speeds. On board security include…
Product
February 6, 2019 by Stephen Law

Ultra-low modulus thermal interface materials contain advanced resin

HENKEL BERGQUIST GAP PAD thermal interface materials (TIMs) comes in two ultra-low modulus, including TGP 6000ULM and TGP 7000ULM, both formulated with an advanced resin platform to deliver ultra-low modulus capabilities and high thermal conductivity of 6.0 W/m-K and 7.0…
News
August 16, 2018 by EP&T Magazine

MIPI Alliance aims to advance autonomous driving

Other automotive applications also impacted by MIPI A-PHY v1.0 with new data interface specifications set at 12-24Gbps and beyond
Product
May 29, 2018 by Stephen Law

17W thermal interface pad lowers thermal resistance

FUJIPOLY AMERICA Sarcon 30XR-m high-performance thermal interface material exhibits a low thermal resistance. The 0.3mm thick TIM is available in dimensional sheets up to 200mm × 150mm or can be die-cut to fit your exact application shape. When placed between…
News
May 11, 2018 by EP&T Magazine

Si2 open model provides industry-wide interface for SPICE capabilities

The Silicon Integration Initiative Compact Model Coalition has released the Open Model Interface, an Si2 standard, C-language application programming interface that supports SPICE compact model extensions.  OMI allows circuit designers to simulate and analyze such important physical effects as self-heating and…