Soldering materials reduce peak reflow temperature

NIHON SUPERIOR TempSave series of low temperature soldering materials address the needs of reduced peak reflow temperature to reduce defects contributing to package warpage, reduce energy consumption during the reflow process, and avoid potential damage to temperature sensitive devices. TempSave B58 is a eutectic SnBi alloy with a melting point of 139°C while TempSave B37 is a ductile hypoeutectic SnBi alloy and does not contain Ag.  High bismuth containing alloys are known to be brittle and therefore poor in drop shock performance. TempSave B37 has improved drop performance, outperforming SAC305.

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