SMT stencil clean roll removes solder paste
Stephen LawElectronics Production / Materials materials production
SMT Stencil Clean Roll is used to remove solder paste residues or other viscous materials allocated into the stencil apertures or stencil contact side surface. Based on the material complexion, the stencil paper is capable of working with ultra-fine pitch apertures, improving cleaning cycle time due high absorption and paper texture allowing better vacuum performance. Material contains a strong tensile strength, high-absorbency with strong performance. Paper material is made of hydraulicy interlaced fibers with no chemical bonding 100% PLP. Features of the SMT Paper Roll include plastic tubes, high absorbency, high tensile strength, liquid absorption 28 second/5cm, 330g water per 1m2. Product works with all stencil technologies, including nano-coated stencil foils.