One part, toughened epoxy for dam-and-fill encapsulation
Stephen LawElectronics Production / Materials bonding component encapsulation epoxy materials production sealing
MASTER BOND Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. This thixotropic paste material was formulated to serve as the damming compound in dam-and-fill encapsulation applications. It can also be utilized for bonding and sealing, especially where no flow is needed since the material cures in place and will not run or slump. The compound requires a relatively low heat cure of 85°C for 2-3 hours, is thermally conductive and electrically non-conductive. As a toughened system, product resists rigorous thermal cycling. It is a reliable electrical insulator and features a thermal conductivity of 5-10 BTU•in/ft2•hr•°F [0.72-1.44 W/(m·K)]. It plays an important role in facilitating effective heat dissipation and preventing overheating, especially in densely packed electronic assemblies. The epoxy maintains a Shore D hardness of 75-85, offers excellent damp heat resistance and has a good physical strength profile.