Electronic Products & Technology

October 15, 2019 by Stephen Law

Thermally conductive potting compound resists high temperatures

MASTER BOND Supreme 121AO NASA low outgassing approved epoxy is suitable for bonding, sealing and potting applications. Featuring a high glass transition temperature of 200-210°C, product resists temperatures up to 550°F. This system exhibits an element of toughness and is…
August 28, 2019 by Stephen Law

UV curable system is not oxygen inhibited

MASTER BOND UV10TK40M one part UV curable system is not oxygen inhibited and can be used for bonding, sealing and coating applications. Product is optically clear, with a refractive index of 1.55. It has a high glass transition temperature (Tg)…
March 25, 2019 by Stephen Law

Gold-coated silver bonding wire ensures high performance

HERAEUS AgCoat Prime gold-coated silver bonding wire for the semiconductor industry provides the bondability and reliability of gold wire, while reducing costs. Product is a silver alloy bonding wire coated with a layer of gold. Product’s specifications are closely aligned…
July 23, 2018 by Stephen Law

Type AuR gold ribbon bonding wire fabricated to 4N specs

TANAKA PRECIOUS METALS  Type AuR Gold Ribbon Bonding Wire is fabricated to 4N specifications with 99.99% purity using a dry process. Sizes range from 12.7µm to 50µm thickness, and widths range from 25µm to 250µm wide. Product is typically packaged…
May 30, 2017 by Stephen Law

Cyanocrylate adhesive combines dual bond and quick cure

NTE ELECTRONICS SureHold 78-22021 Helios Light Cure Cyanocrylate Adhesive combines a dual bonding technology and a premium high quality glue with a speedy light cure. Industrial strength product cures with UV/visible light in instant and photo-cure. Suitable for sensitive electronic…