Electronic Products & Technology



Product
January 15, 2019 by Stephen Law

Thermally conductive underfill epoxy lowers viscosity to 5,000-15,000 cps

MASTER BOND EP3UF-1 single component epoxy is not premixed or frozen and provides a low viscosity of 5,000-15,000 cps. The heat curable thixotropic compound is suitable for underfill and many bonding applications. Product delivers high bond strength and dimensional stability…
Product
November 28, 2018 by Stephen Law

One component epoxy meets low outgassing specs

MASTER BOND EP17HTND-CCM single component epoxy is not premixed or frozen and is more convenient to handle, apply and store than typical two component glob top systems. The black, heat curable compound has a flowable paste consistency suitable for glob…
Product
October 15, 2018 by Stephen Law

High elongation epoxy system boosts thermal shock resistance

MASTER BOND EP110F8-3 two part epoxy system is suitable for sealing, encapsulating, potting, and casting applications. Toughened system improves flexibility and possesses a relatively high elongation of 120-150%. Product delivers a low tensile modulus of around 5,000-15,000psi and a shore…
Product
September 26, 2018 by Stephen Law

Assembly film boosts reliability, adhesion at high temps

HENKEL LOCTITE ABLESTIK CF 3366 epoxy-based, silver-filled film adhesive provides high thermal and electrical conductivity, delivering improved heat dissipation capabilities for robust thermal management. Leapfrogging other commercial assembly films, product addresses miniaturization trends, increasing power density demands and high operating…
Product
September 17, 2018 by Stephen Law

Strong epoxy adhesive is thermally stable

MASTER BOND EP70CN two part, thermally stable epoxy adhesive is formulated using a natural, renewable and sustainable ingredient. Epoxy system forms high physical strength bonds and can be utilized for bonding, sealing, coating and potting. Product’s tensile strength is 11,000…
Product
July 3, 2018 by Stephen Law

Epoxy delivers low coefficient of thermal expansion

MASTER BOND EP30LTE-2 epoxy is developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. Product can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal…
Product
May 10, 2018 by Stephen Law

Epoxy delivers high abrasion resistance

MASTER BOND EP30NS two component epoxy system cures at room temperature or more rapidly at elevated temperatures. Product is optically clear especially in thin sections and can be used as an adhesive, sealant, coating and encapsulation compound. Product provides dimensional…
Product
August 3, 2017 by Stephen Law

Two part epoxy bonds, seals and coats encapsulation

MASTER BOND EP41S-F is a two part epoxy for bonding, sealing, coating and encapsulation applications. Product combines fast ambient temperature cure speed with  chemical resistance and superior electrical insulation properties. Versatile system is easy to handle and has a forgiving…
Product
May 9, 2017 by Stephen Law

Medical grade epoxy system is UV, heat curable

MASTER BOND UV15DC80Med dual cure epoxy based system provides a primary cure using UV light along with a secondary heat cure that can be initiated at the low temperature of 80°C. System was formulated for medical device assembly applications, meeting…
Product
February 24, 2017 by Stephen Law

Low viscosity, electrically insulating epoxy boosts optical clarity

MASTER BOND EP30LP-2 two component epoxy with a low viscosity and a volume resistivity of over 1014 ohm-cm making it suitable for potting and encapsulation applications. The high performance system can also be used for bonding and sealing. The easy…