Electronic Products & Technology



Product
November 12, 2019 by Stephen Law

Chemically resistant epoxy sealant is thermally conductive

MASTER BOND EP62-1AO two-part epoxy adhesive and sealant with a long working life of 12-14 hours at ambient temperature for a 100 gram mass. This makes it beneficial when bonding and sealing large or intricate parts that may need ample…
Product
October 15, 2019 by Stephen Law

Thermally conductive potting compound resists high temperatures

MASTER BOND Supreme 121AO NASA low outgassing approved epoxy is suitable for bonding, sealing and potting applications. Featuring a high glass transition temperature of 200-210°C, product resists temperatures up to 550°F. This system exhibits an element of toughness and is…
Product
September 18, 2019 by Stephen Law

Hybrid epoxy boosts chemical resistance

MASTER BOND EP21TP-2NV two part epoxy polysulfide is formulated for use as an adhesive, sealant and potting system. Product withstands prolonged exposure to many harsh chemicals including fuels, oils, hydrocarbons and hydraulic fluids. It is also fully RoHS compliant, meeting…
Product
June 10, 2019 by Stephen Law

Optically clear, low viscosity epoxy system boosts flexibility

MASTER BOND EP88FL two component epoxy is a highly flexible, optically clear compound formulated for bonding, coating, sealing, potting and encapsulation. Easy to use, with a mixing ratio of one to one by weight or volume, product withstands thermal cycling…
Product
March 13, 2019 by Stephen Law

Silver conductive, one component epoxy cures at 80°C

MASTER BOND Supreme 3HTS-80 one part, silver filled epoxy adhesive is not premixed and frozen and features an unlimited working life at room temperature. Product cures at 175°F to 185°F within 2-3 hours – unlike typical heat activated epoxies that…
Product
February 24, 2019 by Stephen Law

Epoxy resin increases high temperature performance on advanced materials

SUN CHEMICAL EPICLON HP 4770 multi-functional naphthalene epoxy resin increase high temperature performance in aerospace, transportation and electronics applications. Product provides high modulus/stiffness, low water absorption, improved mechanical properties, adhesion and good fiber wet out— all critical factors to success…
Product
January 15, 2019 by Stephen Law

Thermally conductive underfill epoxy lowers viscosity to 5,000-15,000 cps

MASTER BOND EP3UF-1 single component epoxy is not premixed or frozen and provides a low viscosity of 5,000-15,000 cps. The heat curable thixotropic compound is suitable for underfill and many bonding applications. Product delivers high bond strength and dimensional stability…
Product
November 28, 2018 by Stephen Law

One component epoxy meets low outgassing specs

MASTER BOND EP17HTND-CCM single component epoxy is not premixed or frozen and is more convenient to handle, apply and store than typical two component glob top systems. The black, heat curable compound has a flowable paste consistency suitable for glob…
Product
October 15, 2018 by Stephen Law

High elongation epoxy system boosts thermal shock resistance

MASTER BOND EP110F8-3 two part epoxy system is suitable for sealing, encapsulating, potting, and casting applications. Toughened system improves flexibility and possesses a relatively high elongation of 120-150%. Product delivers a low tensile modulus of around 5,000-15,000psi and a shore…
Product
September 26, 2018 by Stephen Law

Assembly film boosts reliability, adhesion at high temps

HENKEL LOCTITE ABLESTIK CF 3366 epoxy-based, silver-filled film adhesive provides high thermal and electrical conductivity, delivering improved heat dissipation capabilities for robust thermal management. Leapfrogging other commercial assembly films, product addresses miniaturization trends, increasing power density demands and high operating…
Product
September 17, 2018 by Stephen Law

Strong epoxy adhesive is thermally stable

MASTER BOND EP70CN two part, thermally stable epoxy adhesive is formulated using a natural, renewable and sustainable ingredient. Epoxy system forms high physical strength bonds and can be utilized for bonding, sealing, coating and potting. Product’s tensile strength is 11,000…
Product
July 3, 2018 by Stephen Law

Epoxy delivers low coefficient of thermal expansion

MASTER BOND EP30LTE-2 epoxy is developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses. Product can be used for sealing, coating and encapsulating, especially for small to medium sized castings where a very low coefficient of thermal…