Non-silicone thermal putty fills gaps on pcb
EP&T MagazineProduction / Materials materials non-silicone pcbs production putty SPI thermal
SP INTERNATIONAL T-GLOBAL – TG-N8000 non-silicone thermal putty is a high thermal conductivity material without added silicon oil that is used to fill the gaps between electronic components and heat sinks. Product retains stable thermal conductivity, resists loss and drying and does not contaminate electronic components. With high temperature resistance and eco-friendly properties, product transfers heat, ensuring optimal performance of electronic components under high temperatures and preventing damage due to overheating.