Electronic Products & Technology

No clean paste reduces voiding to 1% on BGA

Stephen Law   

Electronics Production / Materials material production solder

AIM V9 ultra-low-voiding, no clean paste reduces voiding to as low as 1% on BGA and <5% on BTC components, while exhibiting stable print performance on fine feature devices over 12 hours. Product’s post-process residue is easily probed and possesses high SIR values required for high reliability applications. REACH and RoHS compliant, the high reliability (SIR) product is capable of consistent printing (w/ area ratio < 0.66). Product is available in SAC305-T4 [500g Jars or 600g Cartridges].

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