Next-gen stencil cleaners work quickly, efficiently

KYZEN E5631-E5631J next-generation stencil cleaner solution quickly and efficiently cleans all types of raw solder paste flux from stencils and A-side misprints. Product is designed to be used at low concentrations and ambient temperature in stencil cleaning processes including spray-in-air, understencil and ultrasonic systems. Product was formulated to operate at low concentrations (<25%) while remaining a top performing product. E5631 improves cleaning of all widely used assembly materials, and it rinses easily and completely thus reducing typical dry time.

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