Advanced solutions elevate device performance

HERAEUS ELECTRONICS Welco AP520 state-of-the-art water-soluble type 7 printing paste is designed to solve the challenges of miniaturization, as it can create tiny and reliable joints with close to zero defects. With enhanced paste release down to 90µm pitch (55µm stencil opening and 35µm line spacing), no splashing and best-in-class low void performance, Product serves for fine-pitch components and flip chip attach for next-generation System-in-Package applications used in 5G communications, smart-wearables, and electric vehicles.

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