Underfill epoxy delivers thermal conductivity, electrical insulation
MASTER BOND EP29LPTCHT two component, low viscosity epoxy compound can be utilized for underfill and encapsulation applications. Product does not need excessive heat for curing and has a long working life at room temperature. System is electrically insulative and thermally conductive with very fine particle size filler material. Product can be dispensed into tiny gaps and when used as an adhesive, it forms thin bond lines from 5 to 15 microns, resulting in a significantly low thermal resistance of 12-15 x 10-6K•m2/W.