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Thermal gap fillers serve delicate components


FUJIPOLY AMERICA Sarcon Low Compression Force gap filler pads are suitable for applications that have delicate components or widely varying gap distances. TIMs help avoid overstressing the printed circuit board (pcb) and fragile solder joints as the interface material is compressed between the heatsink and board-level components during assembly. Materials exhibit compression forces less than 15PSI, depending on thickness. Thickness options range from 1.00mm to 5.00mm with thermal conductivity between 1.5 and 2.8W/m•K.

 

 


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