Electronic Products & Technology

Thermal gap fillers serve delicate components

November 25, 2019  Stephen Law

FUJIPOLY AMERICA Sarcon Low Compression Force gap filler pads are suitable for applications that have delicate components or widely varying gap distances. TIMs help avoid overstressing the printed circuit board (pcb) and fragile solder joints as the interface material is compressed between the heatsink and board-level components during assembly. Materials exhibit compression forces less than 15PSI, depending on thickness. Thickness options range from 1.00mm to 5.00mm with thermal conductivity between 1.5 and 2.8W/m•K.




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