Two part epoxy bonds, seals and coats encapsulation
Stephen LawCircuit Protection Electronics Production / Materials Regulations & Standards Contract Manufacturing Engineering Supply Chain bond bonding epoxy epoxy production
MASTER BOND EP41S-F is a two part epoxy for bonding, sealing, coating and encapsulation applications. Product combines fast ambient temperature cure speed with chemical resistance and superior electrical insulation properties. Versatile system is easy to handle and has a forgiving 100 to 25 mix ratio by weight. After mixing, product polymerizes quickly and can usually be removed from a fixture within 20-30 minutes. Full cures are achieved in 24 hours at 75°F or in 45-60 minutes at 200°F.