Thixotropic, one component dual cure epoxy is flexible
EP&T MagazineElectronics Production / Materials epoxy materials production system
MASTER BOND UV23FLDC-80TK is a moderate viscosity, cationic type epoxy system that provides both UV light and heat curing mechanisms. Product cures readily within 20-30 seconds when exposed to a UV light source emitting a wavelength of 320-365 nm. Adhesive can also undergo a secondary heat curing for shadowed areas, typically curing in 60-90 minutes at 80-85°C. System’s adaptability to varying depths and applications, such as encapsulation and bonding, enhances its versatility. Product has a viscosity of 25,000-50,000 cps, and is highly thixotropic, which is advantageous for applications where minimal flow is required. It has a low tensile modulus of 250-500 psi, and a high elongation of 90-100% at room temperature. Its toughness and flexibility allow it to withstand rigorous thermal cycling, making it suitable for applications where low stress is critical.