Thermoelectric cooling modules boost performance in fans, heatsinks

JARO THERMAL active, thermoelectric cooling (TEC) chip modules are designed to work synergistically with existing fan-to-sink products. Devices provide swift, additional performance to fans and heatsinks. Firm’s TEC technology achieves a high level of thermal performance by taking full advantage of the Peltier Effect, utilized for cooling or heating purposes, depending on the direction of the electrical current. TEC modules heat or cool objects in these systems by maintaining a specific temperature. This flexibility in function can be very useful. At the same time, they take up very little space, and are attached to the fans themselves.

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