Electronic Products & Technology



News
October 9, 2019 by EP&T Magazine

Samsung develops industry’s first 12-Layer 3D-TSV chip packaging technology

The new technology allows for the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips
Product
July 11, 2019 by Stephen Law

Compact LEDs boost light intensity

WüRTH ELEKTRONIK WL-SMCC series of SMT chip LEDs are compact and available in 0402 and 0603 packages, while characterized by a full-surface lens design and a significantly higher light intensity than competitor products. Both device package types are available in…
News
June 19, 2019 by EP&T Magazine

Samsung to strengthen its neural processing capabilities for future AI applications

Samsung Electronics, global leader in advanced semiconductor technology, announced that it will strengthen its neural processing unit (NPU) capabilities to further extend the reach of its artificial intelligence (AI) solutions. In line with its focus on next-generation NPU technologies, Samsung…
Product
May 13, 2019 by Stephen Law

Ultra-precision metal film chip resistors boost reliability

KOA SPEER RN73R series metal film chip resistors boost reliability, meeting the demanding requirements of high heat and high moisture applications. Devices provide improved electrolytic corrosion resistance and high stability compared to firm’s existing RN73 thin film resistors. Devices improve…
Product
January 21, 2019 by Stephen Law

‘Trace in Air’ chip fuse withstands high demands

SCHURTER UAI 1206 chip fuse delivers pulse withstand and temperature resistant capabilities, together with time-lag characteristics. The evolved overcurrent protection device is suitable for applications where durability and maximum reliability are required in the smallest possible footprint. Designed using firm’s…
News
May 4, 2018 by Kelvin Chan, The Associated Press, Hong Kong

Chip wars: Tech rivalry underlies US China trade conflict

Chinese and American officials will be trying to defuse tensions pushing the world’s two largest economies toward trade war in meetings beginning Thursday where analysts say chances for a breakthrough seem slim given the two sides’ desperate rivalry in strategic…
Product
March 8, 2018 by Stephen Law

IC delivers chip-to-cloud security right out of the box

NXP A71CH IC is a ready-to-use secure element for IoT devices providing a root of trust at the IC level and delivers, chip-to-cloud security right out of the box, so you can safely connect to IoT clouds and services, including AWS,…
Product
June 16, 2017 by Stephen Law

Platform evaluates functionality of 32-bit FT602 devices

FTDI CHIP UMFT602A and UMFT602X hardware modules enable bridging of a FIFO bus to a USB3.0/1 host and are equipped with either HSMC or FMC (LPC) connectors. Devices provide a simple and straight forward platform on which to evaluate the…