Thermal gap filler exhibits low compression force

FUJIPOLY AMERICA SARCON PG45A high-performance thermal interface materials exhibits a low compression force even at high compression rates. This makes the putty-like product suitable for applications that have delicate or wide-variation component heights and require material compression up to 90%. The low modulus TIM also helps reduce stress on the pcb during assembly. Available in thicknesses from 1.5mm to 2.5mm, product improves cooling performance by completely filling unwanted air gaps that exist between heat generating components and a nearby heatsink. Once installed, material exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5PSI with a thermal conductivity of 4.5W/m°K.

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