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Solder paste lowers melting point range


SHENMAO AMERICA PF735-PQ10 series low temperature solder paste, for automobile electronics is made with the modified Sn/Bi alloy with lower melting point range from 137~142°C to 137~170°C. In comparison with SnAgCu, product provides reduced peak reflow temperature, energy consumption and warpage of pcbs and components. In comparison with the Sn42/Bi58 Eutectic alloy, product improves ductility, finer microstructure and increased drop and thermal reliability.


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