Electronic Products & Technology

Solder paste accelerates adoption for miniaturized assemblies

EP&T Magazine   

Electronics

Indium8.9HFA solder paste is versatile, halogen-free, Pb-free and improves print performance on miniaturized components. Print performance assists sub-8 mil challenges associated with continuing miniaturization in electronics assembly. INDIUM Product provides low cost of ownership and high print yields. Product boosts transfer efficiency for consistent, full volume print deposits (8 mil) results in reduced frequency of insufficients and high first-pass print yields. Low print pressure and quick response-to-pause saves time and money on stencils and line changes.

http://www.indium.com/indium8.9series

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