Power MOSFET delivers double-sided thermal cooling
EP&T MagazineElectronics Power Supply / Management Semiconductors Thermal management cooling MOSFET power semiconductor thermal
ALPHA AND OMEGA SEMICONDUCTOR AONA66916 100V MOSFET packaged in top and bottom side cooling DFN 5 x 6 package. State-of-the-art package keeps semiconductor product cooler, enabling engineers to develop more efficient designs in telecommunications and industrial applications operating in harsh conditions. The top and bottom cooling DFN 5×6 package achieves high heat transfer between the exposed top contact and heat sink due to its large surface contact area construction. This achieves a low thermal resistance (Rthc-top max) of 0.5°C / W with results being transferred to the pcb board, enabling significant thermal performance improvements.