No clean paste solder is ultra-low-voiding
AIM V9 ultra-low-voiding, no clean paste solder assembly material is formulated to reduce voiding to as low as 1% on BGA and <5% on BTC component, while exhibiting stable print performance on fine feature devices over 12 hours. Product’s post-process residue is easily probed and possesses high SIR values required for high reliability applications. REACH and RoHS compliant product is capable of consistent printing with area ratio of < 0.66, and serves as drop-in for M8. Available in SAC305 T4.