Electronic Products & Technology

No-clean leaded solder paste enhances print, reflow process

EP&T Magazine   


FCT ASSEMBLY NC676 no-clean leaded solder paste provides the latest technology in print and reflow in the no-clean category. The halogen-free paste is compatible with 63/37, 62/36/2 alloys with Type 3, 4 and 5 solder meshes. Product provides best-in-class solder spread and wetting, print volume consistency down to 12mm circles and IPC 7095 Class III resistance to voiding using both straight ramp and soak reflow profiles. Product leaves a colorless residue that is penetrable, maximizing pin testability.



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