Specialty powder for flexible films boosts speed in 5G devices
Stephen LawElectronics Production / Materials Wireless 5G materials production wireless
SABIC SD1100P BPADA high-purity specialty dianhydride powder for polyimide (PI) film formulations can be used in 5G flexible printed circuit boards (pcbs), colourless displays and other flexible electronics applications. Product helps users produce high molecular weight PI formulations that can deliver improved balance between thermal and mechanical properties. Product boosts performance, while lowering dielectric constant and dissipation factor, reduces water absorption and improves metal adhesion for creating films and varnishes used in copper-clad laminates, coverlays and adhesives.