Lead-free solder paste reduces voids

NIHON SUPERIOR SN100C P810 D4 high-reliability lead-free solder paste reduces voids in large-area solder joints such as those between power semiconductors and their substrates. Voiding is reduced even further with vacuum reflow. Product is based on the SN100C alloy, a silver-free lead-free solder for hot air solder leveling. SN100CL delivers a bright, uniform and bridge-free coating on fine pitch circuitry.

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