3D AOI system inspects THT solder joints, components
EP&T MagazineElectronics Production / Materials 3D AOI equipment joints production solder system THT
MEK SpectorBOX X series modular full 3D AOI system for THT solder joints and THT components redefines Through-Hole Technology (THT) inspection and can be used bottom-up for volume measurement of THT solder joints and pin height measurement, or Top-Down for a ground-breaking 150mm + clearance for 3D THT components measurement. Product delivers direct volumetric measurements of solder joints from Selective, Wave, Robotic, Pin-in-Paste Reflow, Laser and Manual soldering systems in addition to accurate pin height measurement. Compact system provides a high clearance of 150mm (5.9″) and beyond on the THT components side and over 100mm (3.9″) on the THT solder side to accommodate most conveyor designs. The X, Y and Z-axis moving optics ensure inspection of most pallet designs.