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17W thermal interface pad lowers thermal resistance


FUJIPOLY AMERICA Sarcon 30XR-m high-performance thermal interface material exhibits a low thermal resistance. The 0.3mm thick TIM is available in dimensional sheets up to 200mm × 150mm or can be die-cut to fit your exact application shape. When placed between a heat source such as a semiconductor and a nearby heat sink, product provides a thermal conductivity of 17.0 W/m•K and a thermal resistance of 0.30° C•in2/W. The silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas.


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