FUJIPOLY AMERICA Sarcon 30HR silicone-based thin film exhibits a 1.7 W/mK thermal conductivity when placed between a heat source such as a high-performance semiconductor and a nearby heatsink. The conformable thermal interface medium effectively eliminates air gaps that exist between components. The increased surface contact can measurably improve the cooling performance of a heatsink. Product has a thermal resistance of .42 Cin2/W and is recommended for applications with operational temperatures that range from -60C to +180C.
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