Thermal gap filler serves high power designs
FUJIPOLY AMERICA Sarcon GR80A-00-100GY is a 1.0mm thick thermal interface material that delivers a thermal conductivity of 13.0W/m•K with a thermal resistance of 1. 0° C•in2/W, which are often required in higher-power electronics applications. When placed between heat generating components and a nearby heat sink, the silicone-based material completely fills air gaps between uneven components, board protrusions and recessed areas. This maximizes heat transfer and dissipation, thereby improving overall performance. Product is available in sheets up to 300mm × 200mm or can be die-cut to fit custom applications.