FCT ASSEMBLY NanoSlic Gold Stencil provides advanced stencil technology for solder paste printing. Product is based on a proprietary application process that coats both the underside of the stencil and aperture walls. This robust coating is both highly hydrophobic and oleophobic, which repels solder paste. Product is thermally cured and is a permanent coating. Product’s technology improves solder paste transfer efficiencies for small apertures resulting in higher yields and less rework. Product minimizes bridging and reduces underside cleaning.
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