Silver filled, low outgassing epoxy for EMI/RFI shielding

MASTER BOND EP4S-80 one component silver filled epoxy meets NASA low outgassing requirements. Product has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, product has a smooth flow and is easily brushable, making it suitable for EMI/RFI shielding and static dissipation. This formulation can also be used in a variety of applications where electrical conductivity is required: bonding, sealing, coating, as well as gap filling and encapsulating. Product features improved mechanical properties with a tensile modulus of 500,000-600,000 psi and a compressive strength of 22,000-24,000 psi at 25°C.

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