Silicone potting compound is thermally conductive

CHT USA QSil 553 two-part thermally conductive black silicone potting compound and encapsulant protects electronic components from harsh environmental conditions and achieve efficient heat transfer. The low viscosity product provides convenient dispensing and flowable throughout components. Product delivers UL 94 V-0 listed (UL file QMFZ.E205830)- for flame retardancy. Product has low modulus to minimize coefficient of thermal expansion (CTE) strain. Operating in a wide temperature range (-55C up to 240C), product is thermally conductive, delivering efficient heat transfer.

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