Production reflow process transforms verification

SOLDERSTAR Reflow Shuttle thermal profiling systems for electronic soldering processes attempts to transform reflow process verification. Unit offers precise measurement of critical reflow parameters and delivers improved accuracy and insight into the soldering process. Product boasts a comprehensive set of features to address the complexities of modern reflow environments. It utilises an array of independent sensors to measure top and bottom temperature profiles, providing a comprehensive view of the reflow oven’s performance. This detailed data allows engineers to fine-tune and optimize soldering processes with improved precision.

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