Lead-free solder paste provides continuous high-speed printability
SHENMAO AMERICA PF606-P245 new generation lead-free zero halogen solder paste provides continuous high-speed printability that produces superior solder paste print quality, as well as a wide reflow process window for improved solderability. With a minimal flux residue gathering near the outside of the solder joint on the pcb substrate, product provides a significant improvement over predecessors. Product prevents head-on-pillow issues and produces lower void. Easily fits complicated pcb designs through convergence performance. Product improves ICT testability with flux completely removed from top of solder to prevent contamination of test pins during test operation.
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